PM joins groundbreaking of HCL–Foxconn's India Chip OSAT unit at Jewar, Uttar Pradesh
Prime Minister Narendra Modi joined the groundbreaking of India Chip Pvt Ltd, the HCL–Foxconn semiconductor assembly and test (OSAT) unit at YEIDA, Jewar, Uttar Pradesh, by video conference on 21 February 2026.
Summary
Prime Minister Narendra Modi joined the groundbreaking of India Chip Pvt Ltd, the HCL–Foxconn semiconductor assembly and test (OSAT) unit in the Yamuna Expressway Industrial Development Authority (YEIDA) area at Jewar, Uttar Pradesh, by video conference on 21 February 2026. The facility is being set up under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP) with an investment of over ₹3,700 crore and will serve mobile phones, laptops, automobiles and consumer electronics. HCL says India Chip is a 60:40 joint venture of HCL Group and Foxconn that will make display driver chips, with a planned capacity of 20,000 wafers a month, and is expected to be operational by 2028.
Key facts
- Date
- 21 February 2026 (by video conference)
- Company
- India Chip Pvt Ltd — HCL Group and Foxconn JV (60:40)
- Location
- YEIDA, Jewar, Uttar Pradesh
- Type
- OSAT (Outsourced Semiconductor Assembly and Test)
- Investment
- Over ₹3,700 crore
- Scheme
- Modified Scheme for Semiconductor ATMP
- Capacity
- 20,000 wafers a month; display driver chips; operational by 2028
Practice MCQs 3 questions
PM Modi joined the groundbreaking of the HCL–Foxconn semiconductor unit India Chip Pvt Ltd on 21 February 2026. Where is it located?
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Correct answer: A — Jewar (YEIDA), Uttar Pradesh
The OSAT facility is in the Yamuna Expressway Industrial Development Authority (YEIDA) area at Jewar, Uttar Pradesh.
The India Chip Pvt Ltd unit whose groundbreaking took place on 21 February 2026 involves an investment of over how much?
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Correct answer: B — ₹3,700 crore
PIB said the OSAT facility will be set up with a total investment of over ₹3,700 crore.
Consider the following statements about India Chip Pvt Ltd: 1. It is being set up under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP). 2. It is a wafer fabrication (fab) unit rather than an assembly and test unit. Which of the above is/are correct?
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Correct answer: A — 1 only
Only 1 is correct. India Chip is an OSAT (Outsourced Semiconductor Assembly and Test) facility under the Modified ATMP scheme, not a fab.