Odisha, Intel and 3DGS sign MoU for glass core substrate manufacturing facility
On 29 May 2026 the Government of Odisha, Intel Corporation and 3DGS Inc. (USA) signed an MoU for an Advanced Packaging Glass Core Substrate Manufacturing Facility proposed in the Bhubaneswar–Khurda region.
Summary
Union Electronics & IT Minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi and Intel CEO Lip-Bu Tan witnessed the signing of an MoU between the Government of Odisha, Intel Corporation and 3DGS Inc., USA, on 29 May 2026. It provides a framework to set up an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region, described as one of India's largest high-technology manufacturing investments and building on the India Semiconductor Mission.
Key facts
- Parties
- Government of Odisha, Intel Corporation, 3DGS Inc. (USA)
- Facility
- Advanced Packaging Glass Core Substrate Manufacturing
- Location
- Bhubaneswar–Khurda region, Odisha
- Witnessed by
- Ashwini Vaishnaw, CM Mohan Charan Majhi, Intel CEO Lip-Bu Tan
- Linked to
- India Semiconductor Mission
Practice MCQs 2 questions
In May 2026, the Government of Odisha signed an MoU with Intel and 3DGS Inc. to set up what kind of facility in the Bhubaneswar–Khurda region?
Show answer
Correct answer: B — Advanced Packaging Glass Core Substrate Manufacturing Facility
The MoU provides a framework for an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region.
Which State signed the May 2026 MoU with Intel Corporation and 3DGS Inc. for a glass core substrate facility?
Show answer
Correct answer: A — Odisha
The MoU was signed between the Government of Odisha, Intel Corporation and 3DGS Inc., USA.