Foundation stone laid for India's first advanced 3D glass semiconductor packaging unit at Bhubaneswar
The foundation stone of India's first advanced 3D chip packaging unit, promoted by 3D Glass Solutions, was laid at Info Valley, Bhubaneswar, Odisha, on 19 April 2026 by Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw.
Summary
The foundation stone of India's first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar, Odisha, on 19 April 2026, in the presence of Chief Minister Mohan Charan Majhi and Union Electronics and IT Minister Ashwini Vaishnaw. The Heterogeneous Integration Packaging Solutions project is promoted by 3D Glass Solutions. The Chief Minister said the company is investing nearly ₹2,000 crore and the facility is expected to produce 70,000 glass panels, 50 million assembled units and about 13,000 advanced 3D heterogeneous integration (3DHI) modules a year, for uses such as AI, high-performance computing, defence electronics and telecom. He said Odisha is the only state where both India's first compound semiconductor fabrication unit and its first 3D glass substrate packaging facility are being set up.
Key facts
- Project
- Heterogeneous Integration Packaging Solutions, by 3D Glass Solutions
- Site
- Info Valley, Bhubaneswar, Odisha
- Date
- 19 April 2026
- Investment
- Nearly ₹2,000 crore
- Annual capacity
- 70,000 glass panels; 50 million assembled units; ~13,000 3DHI modules
- Odisha also hosts
- India's first compound semiconductor fab (per CM)
Practice MCQs 3 questions
India's first advanced 3D glass semiconductor packaging unit, whose foundation stone was laid in April 2026, is located in:
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Correct answer: D — Bhubaneswar, Odisha
The foundation stone was laid at Info Valley, Bhubaneswar, Odisha, on 19 April 2026.
Which company is promoting the Heterogeneous Integration Packaging Solutions project at Bhubaneswar?
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Correct answer: D — 3D Glass Solutions
The project is promoted by 3D Glass Solutions.
Consider the following statements about the 3D glass semiconductor packaging project in Odisha: 1. The company is investing nearly ₹2,000 crore in the project. 2. According to the Chief Minister, Odisha is also the site of India's first compound semiconductor fabrication unit. Which of the statements given above is/are correct?
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Correct answer: C — Both 1 and 2
Both are correct as stated by the Chief Minister: an investment of nearly ₹2,000 crore, and Odisha hosting both India's first compound semiconductor fab and first 3D glass substrate packaging facility.