SF Prep Notes

Design Linked Incentive Scheme: 24 chip design projects, 16 tape-outs so far

A PIB backgrounder on 4 January 2026 said MeitY's Design Linked Incentive (DLI) Scheme under the Semicon India Programme supports 24 chip design projects, which have achieved 16 tape-outs, 6 ASIC chips and 10 patents.

Summary

A PIB backgrounder released on 4 January 2026 reviewed the Design Linked Incentive (DLI) Scheme, implemented by the Ministry of Electronics and IT (MeitY) under the Semicon India Programme to build a self-reliant fabless chip design ecosystem. The scheme supports 24 chip design projects in sectors such as video surveillance, drone detection, energy metering, microprocessors, satellite communications and IoT systems-on-chip. DLI-supported projects have achieved 16 tape-outs, 6 ASIC chips and 10 patents, engaged over 1,000 engineers and leveraged more than three times private investment; chip design contributes up to 50% of semiconductor value addition.

Key facts

Scheme
Design Linked Incentive (DLI), MeitY
Programme
Semicon India Programme
Projects
24 chip design projects
Outputs
16 tape-outs; 6 ASIC chips; 10 patents; 1,000+ engineers
Investment
Over 3× private investment leveraged
Why design
Up to 50% of semiconductor value addition

Practice MCQs 3 questions

Q1

The Design Linked Incentive (DLI) Scheme for semiconductor chip design is implemented by which ministry?

Show answer

Correct answer: A — Ministry of Electronics and Information Technology

PIB backgrounder: the DLI Scheme is implemented by MeitY under the Semicon India Programme.

Q2 Advanced

As per PIB's January 2026 backgrounder, how many chip design projects are supported under the DLI Scheme?

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Correct answer: C — 24

PIB backgrounder: 24 DLI-supported chip design projects target strategic sectors; 16 tape-outs, 6 ASICs and 10 patents have been achieved.

Q3 Advanced

Consider the following statements about the Design Linked Incentive Scheme as reported in January 2026: 1. It is part of the Semicon India Programme. 2. DLI-supported projects have achieved 16 tape-outs. 3. The scheme mainly funds the construction of semiconductor fabrication plants. Which of the statements given above is/are correct?

Show answer

Correct answer: D — 1 and 2 only

PIB backgrounder: DLI is under the Semicon India Programme and its projects have achieved 16 tape-outs. It supports fabless chip design, not fab construction, so statement 3 is wrong.

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